1. 2. 3. material content data sheet sales product name tle9832qx issued 21. september 2015 ma# MA001408908 package pg-vqfn-48-29 weight* 130.25 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 4.983 3.83 3.83 38258 38258 leadframe inorganic material phosphorus 7723-14-0 0.018 0.01 138 non noble metal zinc 7440-66-6 0.072 0.06 550 non noble metal iron 7439-89-6 1.433 1.10 11003 non noble metal copper 7440-50-8 58.193 44.67 45.84 446775 458466 wire noble metal gold 7440-57-5 0.782 0.60 0.60 6007 6007 encapsulation organic material carbon black 1333-86-4 0.181 0.14 1388 plastics epoxy resin - 7.656 5.88 58778 inorganic material silicondioxide 60676-86-0 52.446 40.26 46.28 402650 462816 leadfinish non noble metal tin 7440-31-5 2.629 2.02 2.02 20183 20183 plating noble metal silver 7440-22-4 0.614 0.47 0.47 4713 4713 glue plastics epoxy resin - 0.286 0.22 2198 noble metal silver 7440-22-4 0.958 0.74 0.96 7359 9557 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
